Products

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.

High speed Axial Lead Component Insertion Machine AV132 for high productivity with High speed insertion of 0.12 s / component , sequential component supply system and vertical automated feederThis is a high speed axial lead component insertion machine that inserts axial components and jumper wires at high speed (0.12 s/component).A sequential system has been adopted in the component supply unit to improve the operation rate.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm

Printer with built-in PCB sorting function to realize ultra-high speed tact time Ultra high-speed tact: This screen-printer achieves a cycle time of 10 seconds. Built-in PCB sorting function enables the machine to accommodate various line layouts of customers.

The APX300 (S option) is a dry etching system specializing in the processing of chemical compounds and non-volatile materials. It is compatible with wafers of 2 inches to 8 inches and irregular substrates, and two transport methods can be selected: “Atmospheric loading supply ” and “ Vacuum load lock supply ” CE certificated.

This equipment is a single-wafer processing type for wafers of 8 inches or smaller, and can be selected and optimized for a wide range of process applications such as power semiconductors, optical communications, high-frequency communications, RF modules, and MEMS.

In addition, as a post-etching process, the ashing and rinsing chambers can be expanded according to the process application.

High density radial lead component insertion machine for high quality and high production with our company's unique insertion methodThis high density radial lead component insertion machine achieves high productivity with our company's unique guide pin method and component supply section of sequence system.

Compact screen printer with high efficiency production and dual lanes Highly efficient production and dual lanes are realized in a compact size, providing the best functionality for your production configuration.

High speed radial lead component insertion machine for for high efficiency and high quality production with high-speed insertion of 0.14s/ component This is a high-speed radial component insertion machine that achieves high productivity with the electronic component lead chuck system and the sequential component supply system.

Supports high bandwidth NDI® for low latency transmission of high-quality 4K 60p/50p1 video, and SRT3 for high-quality and stable transmission, and also compatible with 12G-SDI output for use in a wide range of situations, from live streaming of events to studio production.

IT/IP-centric platform based on an open software architecture that will bring ground-breaking innovations to many markets in the video industry, starting with a very powerful broadcast video switcher.

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified.