Flip Chip Bonder MD-P300

MD-P300

A flip-chip bonder for high-speed, high-quality placement of bare ICs for cutting-edge devices

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The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.

The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. 

The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.

The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder

Easy process exchange

Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.

Real-time inspection

The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.

User-friendly operation

A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

  • Process versatility
  • Ideal for processors, CMOS, MEMS and power devices
  • Fast and accurate

Key features of MD-P300 Flip-chip Bonder

Key features

The basic structure comprises fixed-point pickup and placement that supports supply of wafers up to ⌀300 mm
Process change is possible by switching the bonding tool(Compatible with GGI/C4/TCB)
High-precision placement of ± 5 um is achieved using the placement nozzle where the chip backside recognition result obtained by a flip camera is feed-forwarded to handling
For productivity, high-speed placement of 5,500 CPH (production output per hour) is achieved

Specifications of MD-P300 Flip-chip Bonder

Specifications table

Model NumberNM-EFF1C
Placement AccuracyXY ( 3σ at Panasonic conditions ) : ±5 μm*1
Substrate dimensionsL 50 mm × W 50 mm to L 330 mm × W 330 mm ( Heating specifications : L 330 mm × W 220 mm )
Die dimensions (mm)L 1 mm × W 1 mm to L 25 mm × W 25 mm ( Thermosonic : L 7 mm × W 7 mm）
Die SupplyWafer frame 12 inches ( Option : 8 inches )
Bonding LoadVCM head : 1 N to 50 N ( Option : 2 N to 100 N )
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