Products
PT-REZ15 Series
PT-REZ15
The next-generation PT-REZ15 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 15,000lm brightness, 4K resolution, and 240 Hz projection capability.
Microelectronics
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Microelectronics
PSX307A Plasma Cleaner
Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames). Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process. Additionally, the option to include a traceability functionality ensures high level process Quality.
Insertion (THT/PTH)
AV132
Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.
Mounting (SMT)
AM100
The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.
Lenses for 3-Chip DLP < 35.000 lumens
ET-D3LEU100(for 3-Chip DLP™ Projectors)
Project in tight spaces from very short throw-distances. With zero offset capability, these two lens options widen the versatility of Panasonic’s 3-Chip DLP™ lineup.
PT-REZ15 Series
PT-REZ12
Evolved 1-Chip DLP™ Projectors Transform Your Experience with a Smooth, Frictionless Workflow.
Microelectronics
PSX307 Plasma Cleaner
The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.
Lenses for 3-Chip DLP < 35.000 lumens
ET-D3LEW200(for 3-Chip DLP™ Projectors)
Zero Offset Ultra Short Throw Fixed-Focus Lens
PT-REQ15 Series
PT-REQ10
The next-generation PT-REQ10 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 10,000lm brightness, 4K resolution, and 240 Hz projection capability.
PT-REZ15 Series
PT-REZ80
Evolved 8,000lm WUXGA 1-Chip DLP™ Projector Transform Your Experience with a Smooth, Frictionless Workflow
Microelectronics
APX300 Plasma Dicer
Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration. Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified.
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