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The Panasonic standard cell is also available in the following specifications: PERFORMARC MTPERFORMARC MT-XL (large work envelope)PERFORMARC MT-XXL (extra-large work envelope)

The Panasonic standard cell is also available in the following specifications: PERFORMARC MTPERFORMARC MT-XL (large work envelope)PERFORMARC MT-XXL (extra-large work envelope)

The Panasonic standard cell is also available in the following specifications: PERFORMARC MTPERFORMARC MT-XL (large work envelope)PERFORMARC MT-XXL (extra-large work envelope)

The system design allows for the coverage of a wide range of different sized work components by utilizing twin workstation manipulation. The cell comprises of the latest technically advanced Panasonic robot and welding components seamlessly integration into a system configuration for simple user-friendly control. The torsion-free base frame design ensures accurate position location of the robot and work piece manipulation providing the capability to pick up and move the total system without any need of programming correction.

he system design allows for the coverage of a wide range of different sized work components by utilizing twin workstation manipulation. The cell comprises of the latest technically advanced Panasonic robot and welding components seamlessly integration into a system configuration for simple user-friendly control. The torsion-free base frame design ensures accurate position location of the robot and work piece manipulation providing the capability to pick up and move the total system without any need of programming correction.

The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.