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Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

Automation / Labor-saving Solution + Intelligent system solution to achieve manufacturing that is further in line with production plan

The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.

The NPM-WX  represents the  next  generation  of  Panasonic’s  mounting  production  concept “Smart manufacturing”. The platform represents higher  line  throughput  and  improved  quality  at  lower cost  thanks  to  integrated  automated  systems.  APC  system  and  automatic  recovery  are  integrated  to provide autonomous line control.  The  incorporated  floor-management system and  remote-operation option  improve  utilisation  combined  with  lower  labour  costs.  Feeder  set-up  and  component supply  navigation  systems  are available, helping  to  reduce  the  work  variations.The  NPM-WX  can  handle  a  wide variety  of  components, from  0402  chip  components  up  to  large  components with  a max. size  of 150x25x40 mm.  Parts can be supplied from  tape,  stick or tray-feeder . Feeder-cart  flexibility can be provided by selecting the existing 30-input feeder cart or inserting two 17-inpu

The NPM-DX provides a greater line throughput, better quality and lower production cost featuring an autonomous line control, which guaranties a stable operation based on automatic functionality. This functionality in combination with the machine set up offers a labor-saving production with improved utilization. In combination with the Panasonic software environment and embedded into an Industry 4.0 philosophy, the user can expect a modern shop floor management system including various remote operation options, feeder setup navigation, component supply navigation etc. In total, the NPM-DX reduces downtimes and increase the line throughput. With 92 400 cph and a feeder capacity for up to 136 reels, the NPM-DX is the ideal solution to meet the expectation of an evolving electronics assembly industry. The NPM-DX can process PCB sizes of up to 510 x 590 mm and place large connectors (up to 150 x 25mm) and other components (up to 120 x 90mm). This and other features make the NPM-DX the best solution for high volume-mix manufacturing.

The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design. The printer is designed for high speed production without changeovers. To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function. Solder paste can refill automatically. Solder mask and the final printing result can be verified with an internal inspection. With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors. The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.

Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.

The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.

Features:Increased Production Time:  (1) Reduces machine availability losses through automation of operations required for model changeover.(2) Reduces machine performance losses through automation of operations involved in production.(3) Increases production time by monitoring machine conditions and thereby performing maintenanceat right times.

Maintenance of printing quality at a consistently high level: Reduces losses due to defective items through various functions that actualizes consistently high-qualityprinting capable of responding to any changes in 5M.

Support for line solution: Realizes high-quality line production through M2M

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The SPV Stencil Printer offers a variety of options to suit different PCBs and production processes for consistent high quality. With its high 10s/PCB cycle time, the SPV eliminates bottlenecks and ensures quality by self-cleaning after every PCB. Three conveyors and the PCB identification function provide different automatic printing set ups for a high throughput. With the machine-to-machine-communication option the SPV Screen Printer is using APC correction data to correct positional printing errors. The SPV Stencil Printer can print multiple 350x300mm (M-size) boards simultaneously. This lowers WIP inventory and reduces changeover times by processing up to 4 unique products at once. The configuration minimizes capital expenditure by reducing printer investment by 50% and maximize the floor space utilization with new hybrid board handling concept and the multi-stage board handling conveyors.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.