Products

Introducing the VMZ82 Series: the world’s smallest and lightest projector in its class1, delivering up to 8,000 lm2 for crisp, vibrant visuals in well-lit spaces. These intuitive LCD projectors integrate seamlessly into any layout, minimizing distractions while simplifying installation with exclusive features. With a stylish body containing recycled plastic and engineered for efficient, low-maintenance operation, the VMZ82 Series revitalizes communication quality in offices, classrooms, and beyond.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The NPM-WX  represents the  next  generation  of  Panasonic’s  mounting  production  concept “Smart manufacturing”. The platform represents higher  line  throughput  and  improved  quality  at  lower cost  thanks  to  integrated  automated  systems.  APC  system  and  automatic  recovery  are  integrated  to provide autonomous line control.  The  incorporated  floor-management system and  remote-operation option  improve  utilisation  combined  with  lower  labour  costs.  Feeder  set-up  and  component supply  navigation  systems  are available, helping  to  reduce  the  work  variations.The  NPM-WX  can  handle  a  wide variety  of  components, from  0402  chip  components  up  to  large  components with  a max. size  of 150x25x40 mm.  Parts can be supplied from  tape,  stick or tray-feeder . Feeder-cart  flexibility can be provided by selecting the existing 30-input feeder cart or inserting two 17-inpu

Featuressmart-factory-solutions software panacim-logo-02PanaCIM-EE Gen2 is the next generation of PanaCIM-EE, which allows for more efficient electronics manufacturing. This digital planning tool is necessary to enable reliable data management. This applies not only to individual systems, but to entire production lines, in which the data of each individual machine is included in the analysis. In addition, data from reports and management are included in the planning. This allows higher production rates and shorter cycle times to be achieved to make electronics production even more efficient and reliable. The PanaCIM-EE Gen2 is the next generation of a smart factory solution, connecting the shop floor with overall the management system. This includes precise inventory management, maximized factory performance based on a continuous production, total traceability, real time monitoring and optimization and an accurate in-time material supply. Material verificationMaterial controlTraceabilityProduction monitoring/dispatchProduction analysisMaintenanceEnterprise link

NPM-DGS: line management system

DLP™ imaging technology, Quartet Colour Harmonizer, Rich Colour Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, colour, and clarity regardless of ambient light levels.Powered 0.8:1 short-throw lens for rear projection joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals2. Separate LAN terminal and USB-DC outlet further streamline installation. Operation is almost inaudible at 27 dB3.Heat-pipe cooling for the laser modules and heat-sinks for airtight DMD block support filterless design for 20,000 hours of maintenance-free projection. Multi-Laser Drive Engine has failover circuit protection while optional Early Warning software reinforces reliability.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The SPV Stencil Printer offers a variety of options to suit different PCBs and production processes for consistent high quality. With its high 10s/PCB cycle time, the SPV eliminates bottlenecks and ensures quality by self-cleaning after every PCB. Three conveyors and the PCB identification function provide different automatic printing set ups for a high throughput. With the machine-to-machine-communication option the SPV Screen Printer is using APC correction data to correct positional printing errors. The SPV Stencil Printer can print multiple 350x300mm (M-size) boards simultaneously. This lowers WIP inventory and reduces changeover times by processing up to 4 unique products at once. The configuration minimizes capital expenditure by reducing printer investment by 50% and maximize the floor space utilization with new hybrid board handling concept and the multi-stage board handling conveyors.

Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.