Products

1.3-1.7:1 throw ratio (WUXGA)

0.55-0.65:1 Throw Ratio 3-Chip DLP™ Zoom Lens for PT-RQ50 projector with Lens Memory and Stepping Motor

1.11~1.70:1 for PT-RQ50K (Aspect 17:9) 1.32~2.02:1 for PT-RQ50K (Aspect 16:10) 1.18~1.81:1 for PT-RQ50K (Aspect 16:9) 1.58~2.43:1 for PT-RQ50K (Aspect 4:3)

1.3-1.9:1 throw ratio (WUXGA)

0.78-0.98:1 throw ratio (WUXGA)

5.0-7.1:1 Throw Ratio 3-Chip DLP™ Zoom Lens for PT-RQ50 projector with Lens Memory and Stepping Motor

1.7-2.4:1 throw ratio (WUXGA) Zoom Lens for 3-Chip DLP Projectors

1.7-2.4:1 throw ratio (WUXGA)

The AW-UE80W/K is a PTZ camera suitable for capturing the natural facial expressions of actors/performers and for recording events without spoiling the ambiance. The dome-shaped design minimizes “the feeling of being recorded on video” while the new direct-drive motor produces a very quiet operating sound so it won’t disturb the production activities or spoil the ambiance. The camera offers high-image-quality 4K/60p resolution, wide 74.1° angle, and optical zoom with up to 24x magnification to achieve superb video image quality. The AW-UE80W/K also offers excellent stability and security during video streaming so it can be used for any type of video production. From the production of a reality show to the recording of an internal business or educational event, the top-of-the-line standard model, AW-UE80W/K, can be used in a diversity of applications.

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Handstrap for TOUGHBOK CF-33.

Inheriting the evolving concept and ease of use of TAWERS.Next-generation robot controller to enhance circular business model.