Products
Microelectronics
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Microelectronics
APX300 Plasma Dicer
Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration. Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified.
Keyboards
FZ-VEKG21RM
TOUGHBOOK G2 Rubber Keyboard.
Battery Chargers
FZ-VCBG21A
FZ-VCBG21A
Carrying Solutions
FZ-VSTG21U
Rotating Handstrap for TOUGHBOOK G2.
Batteries
FZ-VZSU1TU
FZ-VZSU1TU
Keyboards
FZ-VEKG21LM
TOUGHBOOK G2 Emissive Backlit Keyboard.
Mounts and Vehicle Docks
FZ-VEBG21U
TOUGHBOOK G2 Desktop Cradle / Dock
Stylus Pen & Tether
CF-VNP026U
CF-VNP026U
Batteries
FZ-VZSU1UU
Extended Battery for TOUGHBOOK G2.
Stylus Pen & Tether
FZ-VNP551U
FZ-VNP551U
Batteries
FZ-VZSU1HU
FZ-VZSU1HU
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