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Microelectronics

MD-P300 Flip-chip Bonder

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Microelectronics

APX300 Plasma Dicer

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Keyboards

FZ-VEKG21RM

TOUGHBOOK G2 Rubber Keyboard.

Battery Chargers

FZ-VCBG21A

FZ-VCBG21A

Carrying Solutions

FZ-VSTG21U

Rotating Handstrap for TOUGHBOOK G2.

Batteries

FZ-VZSU1TU

FZ-VZSU1TU

Keyboards

FZ-VEKG21LM

TOUGHBOOK G2 Emissive Backlit Keyboard.

Mounts and Vehicle Docks

FZ-VEBG21U

TOUGHBOOK G2 Desktop Cradle / Dock

Stylus Pen & Tether

CF-VNP026U

CF-VNP026U

Batteries

FZ-VZSU1UU

Extended Battery for TOUGHBOOK G2.

Stylus Pen & Tether

FZ-VNP551U

FZ-VNP551U

Batteries

FZ-VZSU1HU

FZ-VZSU1HU

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