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MD-P300 Flip-chip Bonder
MD-P300
High yield, high throughput ultrasonic flip-chip bonding.
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.
The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head.
The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.
The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder
Easy process exchange
Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.
Real-time inspection
The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.
User-friendly operation
A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
- Process versatility
- Ideal for processors, CMOS, MEMS and power devices
- Fast and accurate
Key features
Easy process exchange |
Real-time inspection |
User-friendly operation |
Specifications table
Model Number | NM-EFF1C |
---|---|
Productivity | C4: 0.65s/IC (including dipping motion) Thermosonic: 0.65s/IC (including US process time of 0.2s) |
Placement Accuracy | XY (3σ at PFSC conditions): ±5µm |
Substrate dimensions | L 50 × W 50 to L 330 × W 330 (Heating specifications: L 330 × W 220mm) |
Die dimensions (mm) | L 1 × W 1 to L 25 × W 25 (Thermosonic: L7 × W7) |
Number of die types | Up to 12 product types (AWC specifications) nozzle type |
Die Supply | Wafer frame 12 inches (Option: 8 inches) |
Bonding Load | VCM head: 1N to 50N (Option: 2N to 100N) |
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