Products

1.7-2.4:1 throw ratio (WUXGA)

0.8-1.0:1 throw ratio (WUXGA)

0.8:1 throw ratio (WUXGA)

0.690-0.950:1 Throw Ratio Zoom lens for PT-MZ16KL/MZ13KL/MZ10KL

0.950-1.36:1 Throw Ratio Zoom lens for PT-MZ16KL/MZ13KL/MZ10KL

0.480-0.550:1 Throw Ratio Zoom lens for PT-MZ16KL/MZ13KL/MZ10KL

0.550-0.690:1 Throw Ratio Zoom lens for PT-MZ16KL/MZ13KL/MZ10KL

Zoom lens for LCD projectors is designed for compatibility with the PT-MZ20 Series projectors.

Zoom lens for LCD projectors is designed for compatibility with the PT-MZ20 Series projectors.

Smoke cut filter

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.