Products

This software resolves challenges at each level—Edge, Line, and Floor—necessary for production execution. PanaCIM consists of multiple modules, allowing module selection tailored to customer needs.

In order to support productivity, quality control, and process methods in mounting production, it is necessary to control and manage the entire line as a whole, including not only Panasonic equipment but also equipment from other manufacturers. iLNB achieves this through various communication methods with equipment from other manufacturers.

TOUGHBOOK 55 with Windows 11 Pro, magnesium chassis, flexible configurations and universal bay is the most versatile 14" rugged Toughbook ever built, but doesn't compromise on durability, with an unique 'honeycomb' design for improved strength and splash resistant design. In terms of flexibility, the TOUGHBOOK 55 is equally outstanding. It offers a huge array of configuration options, making it easier for customers to have exactly the device they want.

Modular mounter for the pursuit of net productivity and high versatility

This modular mounter inherits the various units and functions of our company NPM series of high-speed mounters, achieves high-quality placement, and achieves both high productivity and versatility. In addition to a wide range of components, large-capacity component supply sections ,and large PCB, the combination of a wide range of machine configurations and a plethora of options provides the optimal line for all types of production.

Modular placement machine with high productivity and placement accuracy This modular mounter achieves both high productivity and high accuracy by improving the basic performance of key units such as the placement head and recognition camera. It is compatible with a wide range of components and a variety of supply units layouts. It also supports a variety of automation and labor-saving functions, including the Auto Setting Feeder (ASF), which automates parts supply work, to flexibly meet the demands of each mounting site.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.

High speed Axial Lead Component Insertion Machine AV132 for high productivity with High speed insertion of 0.12 s / component , sequential component supply system and vertical automated feederThis is a high speed axial lead component insertion machine that inserts axial components and jumper wires at high speed (0.12 s/component).A sequential system has been adopted in the component supply unit to improve the operation rate.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm

Printer with built-in PCB sorting function to realize ultra-high speed tact time Ultra high-speed tact: This screen-printer achieves a cycle time of 10 seconds. Built-in PCB sorting function enables the machine to accommodate various line layouts of customers.

The APX300 (S option) is a dry etching system specializing in the processing of chemical compounds and non-volatile materials. It is compatible with wafers of 2 inches to 8 inches and irregular substrates, and two transport methods can be selected: “Atmospheric loading supply ” and “ Vacuum load lock supply ” CE certificated.

This equipment is a single-wafer processing type for wafers of 8 inches or smaller, and can be selected and optimized for a wide range of process applications such as power semiconductors, optical communications, high-frequency communications, RF modules, and MEMS.

In addition, as a post-etching process, the ashing and rinsing chambers can be expanded according to the process application.

High density radial lead component insertion machine for high quality and high production with our company's unique insertion methodThis high density radial lead component insertion machine achieves high productivity with our company's unique guide pin method and component supply section of sequence system.