Products

DLP™ imaging technology, Quartet Colour Harmonizer, Rich Colour Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, colour, and clarity regardless of ambient light levels. Flexible 2.0x zoom lens with V/H Lens-Shift joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals2. Separate LAN terminal and USB-DC outlet further streamline installation. Operation is almost inaudible at 27 dB4.Heat-pipe cooling for the laser modules and heat-sinks for airtight DMD block support filterless design for 20,000 hours of maintenance-free projection. Multi-Laser Drive Engine has failover circuit protection while optional Early Warning software reinforces reliability.

DLP™ imaging technology, Quartet Color Harmonizer, Rich Color Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, color, and clarity regardless of ambient light levels. Flexible 2.0x zoom lens with V/H Lens-Shift joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals2. Separate LAN terminal and USB-DC outlet further streamline installation. Operation is almost inaudible at 27 dB4.Heat-pipe cooling for the laser modules and heat-sinks for airtight DMD block support filterless design for 20,000 hours of maintenance-free projection. Multi-Laser Drive Engine has failover circuit protection while optional Early Warning software reinforces reliability.

4,000-lm-class SOLID SHINE Laser Projectors Revitalize Communication with WUXGA Images

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

4,000-lm-class SOLID SHINE Laser Projectors Revitalize Communication with WUXGA Images

4,000-lm-class SOLID SHINE Laser Projectors Revitalize Communication with WUXGA Images

4,000-lm-class SOLID SHINE Laser Projectors Revitalize Communication with WUXGA Images

4,000-lm-class SOLID SHINE Laser Projectors Revitalize Communication with WUXGA Images

World’s Smallest, Lightest, and Quietest 11,000 lm* Projector with WUXGA Resolution and LCD Technology.

DLP™ imaging technology, Quartet Colour Harmonizer, Rich Colour Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, colour, and clarity regardless of ambient light levels.Powered 0.8:1 short-throw lens for rear projection joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals2. Separate LAN terminal and USB-DC outlet further streamline installation. Operation is almost inaudible at 27 dB3.Heat-pipe cooling for the laser modules and heat-sinks for airtight DMD block support filterless design for 20,000 hours of maintenance-free projection. Multi-Laser Drive Engine has failover circuit protection while optional Early Warning software reinforces reliability.