Products
APX300 Dry Etcher（S Option）
The APX300 (S option) is a dry etching system specializing in the processing of chemical compounds and non-volatile materials. It is compatible with wafers of 2 inches to 8 inches and irregular substrates, and two transport methods can be selected: “Atmospheric loading supply ” and “ Vacuum load lock supply ” CE certificated.
This equipment is a single-wafer processing type for wafers of 8 inches or smaller, and can be selected and optimized for a wide range of process applications such as power semiconductors, optical communications, high-frequency communications, RF modules, and MEMS.
In addition, as a post-etching process, the ashing and rinsing chambers can be expanded according to the process application.
RG131/RG131-S
High density radial lead component insertion machine for high quality and high production with our company's unique insertion methodThis high density radial lead component insertion machine achieves high productivity with our company's unique guide pin method and component supply section of sequence system.
RL132
High speed radial lead component insertion machine for for high efficiency and high quality production with high-speed insertion of 0.14s/ component This is a high-speed radial component insertion machine that achieves high productivity with the electronic component lead chuck system and the sequential component supply system.
