MD-P300 Flip-chip Bonder

MD-P300

High yield, high throughput ultrasonic flip-chip bonding.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.

The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head.

The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.

The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder

Easy process exchange

Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.

Real-time inspection

The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.

User-friendly operation

A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Process versatility
Ideal for processors, CMOS, MEMS and power devices
Fast and accurate

Key features

Easy process exchange

Real-time inspection

User-friendly operation

Specifications table

Model Number	NM-EFF1C
Productivity	C4: 0.65s/IC (including dipping motion) Thermosonic: 0.65s/IC (including US process time of 0.2s)
Placement Accuracy	XY (3σ at PFSC conditions): ±5µm
Substrate dimensions	L 50 × W 50 to L 330 × W 330 (Heating specifications: L 330 × W 220mm)
Die dimensions (mm)	L 1 × W 1 to L 25 × W 25 (Thermosonic: L7 × W7)
Number of die types	Up to 12 product types (AWC specifications) nozzle type
Die Supply	Wafer frame 12 inches (Option: 8 inches)
Bonding Load	VCM head: 1N to 50N (Option: 2N to 100N)

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