Products

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

TOUGHBOOK G2 Rubber Keyboard.

Rotating Handstrap for TOUGHBOOK G2.

TOUGHBOOK G2 Emissive Backlit Keyboard.

TOUGHBOOK G2 Desktop Cradle / Dock

TOUGHBOOK FZ-55 Desktop Port Replicator / Dock.

The PLV100 carries on the legacy of VariCam with a cinematic look, Vlog and dual native ISO, and streamlines multicamera live shooting to deliver another purpose built studio cameras for easy Cine-live production

TOUGHBOOK FZ-40 Capacitive Stylus Pen.

Battery for TOUGHBOOK FZ-40.

Panasonic's Visual Preset Software adds intuitive GUI-based operation to the free to download PTZ Control Centre software. This enables the management and control of PTZ camera presets whilst incorporating photos and layout diagrams assigned by the user.

Panasonic KX-VC2000 HD Visual Communication System allows efficient communication and information sharing between up to 24 sites with minimum initial setting costs. The HDVC System incorporates Panasonic's high-quality image and sound technologies.